基于红外热成像的电路板载器件故障检测
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国家自然科学基金项目(No.61671412);教育部留学回国人员科研启动基金项目(No.2014-1685);宁波市科技惠民项目(No.2017C50011);宁波市自然基金项目(No.2016A610222);河南省高校科技创新团队项目(No.18IRTSTHN016);国网宁波电力公司创新咨询项目资助


Defect detection for circuit-board-mounted devices based on infrared imaging
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    摘要:

    现有红外热成像电路故障检测方法一般需要与同型号电路的标准红外热图像进行参考比对,使用范围受到限制。为此提出一种无需标准红外热图像的电路板载器件故障情况自动检测算法。算法采用生长—消除法分割提取红外热图像中发热区域,采用最小二乘法四次多项式拟合计算发热器件表面温度,配合环境温度和器件封装计算发热器件内部PN结温,从而判定器件故障。在Ubuntu 16.04和OpenCV 3.0环境下进行了实验测试,验证了所提算法的有效性。

    Abstract:

    Most of the existing infrared-imaging-based methods for circuit fault detection usually need the corresponding standard reference infrared images for comparison,which restricts their practical application. A novel operating temperature and fault detection algorithm for circuit-board-mounted devices without standard reference infrared images is proposed. The region growing and eliminating technique is employed to extract heating areas. Then,the surface temperatures of heating devices are calculated by using least squares and quartic polynomial fitting methods. According to ambient temperature and device package,the temperatures of internal PN junctions of heating devices can be calculated to judge the device fault. Experiments are conducted under Ubuntu16.04 and OpenCV3.0,and experimental results verify the validity of this algorithm.

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吕昂,陈怡,方晋甬,朱仲杰.基于红外热成像的电路板载器件故障检测[J].激光与红外,2018,48(5):579~584
Lü Ang, CHEN Yi, FANG Jin-yong, ZHU Zhong-jie. Defect detection for circuit-board-mounted devices based on infrared imaging[J]. LASER & INFRARED,2018,48(5):579~584

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  • 在线发布日期: 2018-05-29
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