Via is an important part of multi-layer PCB,which is restricted by the processes of drilling and plating and become unreliable.In order to prevent the impact of electrical connection and welding quality,it is necessary to ensure the reliability of via.In this paper,a new via quality detection method is introduced which is infrared thermography.Through many experiments it is found that the detection process is fast,efficient and feasible.
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刘文霞,张焱,沈京玲,陶宁.红外热成像技术在PCB板过孔质量检测中的应用[J].激光与红外,2010,40(3):254~256 LIU Wen-xia, ZHANG Yan, SHEN Jing-ling, TAO Ning. Application of infrared thermography in PCB via quality detection[J]. LASER & INFRARED,2010,40(3):254~256