Based on Infrared transmission theory,quality test system for wafer bonded interface was set up using optical method with cold light source.With this system,quality of bonded interface for materials of GaAs and InP could be judged.This system also offered a real-time inspection for the blade insertion test.Meanwhile,optimal surface treatment method is selected by infrared transmission and film transferring pictures for bonding of GaAs-based distributed Bragg reflector (DBR) and InP-based active region.The infrared transmission system is believed to be an excellent platform for judgment and select of bonded sample,effectively decreasing experimental period and cost.It also offers reliable experiment data for optimization and analysis of wafer bonding parameters.