中短波HgCdTe金属接触的退火研究
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Thermal annealing of HgCdTe and metal contact
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    摘要:

    为制备良好的碲镉汞金属接触,研究了热退火处理对中短波Hg空位掺杂碲镉汞金属接触的影响。对中短波HgCdTe-Sn/Au接触及中波HgCdTe-Cr/Au接触经不同条件退火后的接触进行了测量。对于短波碲镉汞,p型HgCdTe-Sn/Au接触经95 ℃,30 min退火可降低比接触电阻2个量级,而经125 ℃,30 min退火可降低3个量级;离子注入的n型HgCdTe-Sn/Au接触则容易形成欧姆接触。对于中波碲镉汞,退火前p型HgCdTe-Sn/Au接触平均比接触电阻为10-1 Ωcm2量级,经适当条件退火可以降低3个量级;此外,Sn/Au比Cr/Au更适合作为中波HgCdTe的接触金属。因而HgCdTe金属接触可通过一定退火处理得到改善。

    Abstract:

    For improving HgCdTe MS contacts,the influence of thermal annealing on metal contact on short and middle-wavelength HgCdTe is investigated in this paper.The contact specific resistivity ρc was measured by the transmission line method(TLM).For short wavelength,p-HgCdTe-Sn/Au contact is obviously a Schottky junction,but the mean contact specific resistivity decreases about 2 order of magnitude after 95 ℃,30 min annealing;and 125 ℃, 30 min annealing would make the mean contact specific resistivity decrease about 3 order of magnitude.n-HgCdTe-Sn/Au contact is an Ohmic contact without annealing.For the middle wavelength,the mean specific resistivity of P-HgCdTe-Sn/Au contact is about 10-1 Ωcm2 magnitude before annealing.A three order of magnitude decrease in specific resistivity has been observed after 70 ℃,125 ℃ and 155 ℃ annealing with different times,furthermore,it is found that Sn/Au is more suitable than Cr/Au to be HgCdTe MS contact metal.So the HgCdTe MS contact can be improved by thermal annealing.

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李海滨,林春,胡晓宁,何力.中短波HgCdTe金属接触的退火研究[J].激光与红外,2011,41(5):542~547
LI Hai-bin, LIN Chun, HU Xiao-ning, HE Li. Thermal annealing of HgCdTe and metal contact[J]. LASER & INFRARED,2011,41(5):542~547

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