The flip chip process of IRFPAs is introduced and the major parameters of FC300&FC150 are compared. In contrast with FC150, FC300 have higher accuracy and more functions. 2K×2K large format IRFPAs interconnection experiments made by using selflevelling in LETI lab and interferometer system in large IRFPAs applications are reviewed.
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谢珩,张毓捷,王宪谋.超大规模红外器件混成互连的新设备与新方法[J].激光与红外,2013,43(9):1048~1050 XIE Heng, ZHANG Yu-jie, WANG Xian-mou. New flip chip equipment and its application for large IRFPAs interconnection[J]. LASER & INFRARED,2013,43(9):1048~1050