Mechanical polish and chemical mechanical polish are used to back-thin the CdZnTe substrate of HgCdTe infrared focal plane arrays. The special etch liquid is applied to remove the remaining CdZnTe substrate, and the HgCdTe exposes totally. The experiment results indicate that the reliability of HgCdTe MW1280×1024 device after back-thinning is greatly improved.
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李春领,刘海龙.碲镉汞焦平面器件背面减薄技术[J].激光与红外,2014,44(6):637~639 LI Chun-ling, LIU Hai-long. Back-thinning technology of HgCdTe infrared focal plane array[J]. LASER & INFRARED,2014,44(6):637~639