Substrate thinning technology has a great significance for raising performance of quantum well infrared detector (QWIP). Through substrate thinning,thermal expansion mismatch between detector chip and ROIC is decreased,which improves the reliability of chip and reduces the crosstalk. Combined with mechanical polishing,chemical mechanical polishing and selective wet etching,complete elimination of QWIP substrate is accomplished.
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孙海燕,刘海龙,胡小燕,谢珩.量子阱红外探测器衬底完全去除技术研究[J].激光与红外,2014,44(11):1213~1215 SUN Hai-yan, LIU Hai-long, HU Xiao-yan, XIE Heng. Study on complete elimination of substrate of quantum well infrared photodetector[J]. LASER & INFRARED,2014,44(11):1213~1215