Diode laser packaging technology has important influence on laser performances,such as the laser output characteristics and life time,etc,and the choice of solder and welding process are the most critical factors.Au80Sn20 alloy solder was prepared on WCu heat sink by using magnetron sputtering method,and it replaced the traditional In solder,and then the welding process was improved.Comparative study shows that the performance parameters of DL chip welded by Au80Sn20 solder alloy are very close to that of the import deposition.This means that the double-target layered sputter coating can achieve high power diode laser package,which lay the foundation of optimizing the preparation technology of diode laser and improving the performance of diode laser.