A new type of micro-tubes and their application in ultra large HgCdTe arrays were introduced in this paper.HgCdTe arrays processed with micro-tubes can be prepared using conventional metal deposition,lithography and etching equipment.During flip interconnection,HgCdTe chip interconnects with readout circuit by inserting indium ball in readout circuit through micro-tube electrode.Using micro-tube electrode interconnection,the interconnect pressure is about 65 % lower than the existing process.Furthermore in the flip interconnect process,the requirements of the chip flatness and interconnect accuracy were reduced,and the interconnect success rate was greatly improved.