光纤激光加工对Ti6Al4V粘接强度影响的研究
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国家重点研发计划资助项目(No.2018YFB1107703);肇庆市科技计划资助项目(No.2019K023);四会市科技计划资助项目(No.2018020103)资助


The effects of fiber laser processing on Ti6Al4V bonding strength
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    摘要:

    为了在Ti6Al4V表面加工不同的微结构,改变其表面形貌,从而提高其粘接接头的强度,采用纳秒光纤脉冲激光对Ti6Al4V表面进行了微加工,研究了脉冲能量和扫描间距对线阵及网格2种微结构的表面形貌及粘接接头强度的影响。结果表明:当脉冲能量和扫描间距相同时,网格结构比线阵结构能获得更大的粗糙度及表面积;激光加工能有效提高Ti6Al4V粘接接头的强度,线阵结构和网格结构分别在λ=50 %、ψ=100 %,λ=0 %、ψ=100 %时,接头有最大剪切强度,分别为25.2 MPa、 27.2 MPa,与未经激光处理的粘接接头相比,其强度分别提高50.5 %,62.5 %;当脉冲能量和扫描间距相同时,网格结构相比线阵结构更有利于提高接头的强度。该研究对改善Ti6Al4V粘接接头强度具有一定参考意义。

    Abstract:

    In order to process different microstructures on the surface of Ti6Al4V and change its surface morphology,thereby improving the strength of its bonded joints,the surface of Ti6Al4V was micromachined by nanosecond fiber pulse laser,the pulse energy and scanning interval of the laser were studied on the linear array and the influence of the surface morphology of the two microstructures of the grid and the strength of the bonded joint.The results show that when the pulse energy and the scanning interval are the same,the grid structure can obtain greater roughness and surface area than the linear array structure;laser processing can effectively improve the strength of the Ti6Al4V bonded joint;the linear array structure and the grid structure are respectively λ=50 %,ψ=100 %,λ=0 %,ψ=100 %,the joint has the maximum shear strength,respectively 25.2 MPa,27.2 MPa,compared with the non-laser bonded joint,its strength increased by 50.5 % and 62.5 % respectively;when the pulse energy and the scanning interval are the same,the grid structure is more conducive to improving the strength of the joint than the linear array structure.This study has certain reference significance for improving the strength of Ti6Al4V adhesive joints.

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张冲,王冠,刘赞丰,张雅文.光纤激光加工对Ti6Al4V粘接强度影响的研究[J].激光与红外,2021,51(5):600~606
ZHANG Chong, WANG Guan, LIU Zan-feng, ZHANG Ya-wen. The effects of fiber laser processing on Ti6Al4V bonding strength[J]. LASER & INFRARED,2021,51(5):600~606

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  • 在线发布日期: 2021-06-30
  • 出版日期: 2021-05-20