With the wide application of infrared focal plane detector,its packaging structure develops in several directions.On the one hand,it is the miniaturization structures,and on the other hand,it is multiple focal plane splicing structures.All structures need to devise electrical frame in Dewar package.In this paper,several materials that can be used for electrical frame is introduced,and the thermal stress,processing technology and electrical parameters are compared.Then,according to the current size of the detector,packaging structure,and application,the suggestions on the selection of processing materials and processes in the design of the electrical framework are given.Finally,the design method of electrical frame and precautions are introduced.