The reliability of infrared focal plane array detectors is is intimately connected with the manufacturing process control requirements.In this paper,the idea of reliability assessment of detector is analyzed.Referring to the problems of reliability tests in current standards,during chip and Dewar assembly,die shear strength and wire bonding strength tests were studied. The research results provide the basis for guiding the development and production of infrared focal plane array detectors,evaluating their quality and reliability,and laying the foundation of the standard preparation for the infrared(IR) detectors field.
LIU Ruo-bing, WANG Shuang, CHEN Qin, YU Song-lin, MAO Jing-xiang, CHEN Hong-lei. Study on bonding and shear reliability test of infrared focal plane detector[J]. LASER & INFRARED,2022,52(6):861~869