Te掺杂的GaSb材料载流子特性研究
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Study on carrier characteristics of Te doped GaSb materials
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    摘要:

    非故意掺杂的GaSb材料呈现p型导电,限制了GaSb材料在InAs/GaSb超晶格红外探测器等领域的应用。探究N型GaSb薄膜电学特性对估算超晶格载流子浓度以及制备超晶格衬底、缓冲层、电极接触层等提供了一定的理论依据。Te掺杂能够以抑制GaSb本征缺陷的方式实现N型GaSb薄膜的制备,利用分子束外延(Molecular Beam Epitaxy,MBE)技术,设置GaTe源温分别为420℃、450℃、480℃,分别在GaSb衬底与GaAs衬底上生长不同GaTe源温度下掺杂的GaSb薄膜,通过霍尔测试探究GaSb薄膜的电学特性。在77 K的霍尔测试中,发现在GaAs衬底上生长的GaSb薄膜均显示为N型半导体,载流子浓度随源温升高而增加。与非故意掺杂的GaSb相比,源温为420℃、450℃时由于载流子浓度增加而导致的杂质散射,迁移率大幅提高,且随温度升高而增加,但在480℃时,由于缺陷密度减小,迁移率大大减小。在GaSb衬底上生长7000  Be掺杂的GaSb缓冲层,再生长5000  Te掺杂的GaSb薄膜。结果发现,由于P型缓冲层的存在,当源温为420℃时,薄膜显示为P型半导体,空穴载流子的存在导致薄膜整体载流子浓度增加,且空穴和电子的补偿作用使迁移率大幅降低。源温为450℃、480℃时,薄膜仍为N型半导体,载流子浓度随温度增加,且为GaAs衬底上生长的GaSb薄膜载流子浓度的2~3倍;迁移率在450℃时最高,480℃时减小。设置GaTe源温为450℃时GaSb薄膜的载流子浓度较高且迁移率较高,参与超晶格材料的制备能够使整个材料的效果最佳。

    Abstract:

    Undoped GaSb material exhibits P type characteristic,which limits its application of GaSb materials in the fields such as InAs/GaSb superlattice infrared detectors.The theoretical basis for estimating superlattice carrier concentration and growing superlattice substrate,buffer layer and electrode contact layer can be provided by exploring the electrical properties of N type GaSb films.Te doping can achieve the preparation of N type GaSb films by suppressing GaSb intrinsic defects.Molecular Beam Epitaxy technology is used to get the doped GaSb films which are grown on GaSb substrate and GaAs substrate at different GaTe source temperatures.GaTe source temperatures are set at 420℃,450℃ and 480℃,respectively,and the electrical characteristic of GaSb films are investigated by Hall test.In the Hall test at 77K,it is found that all GaSb films grow on the GaAs substrate showing N type semiconductors,with carrier concentration increasing with source temperature.Compared with the undoped GaSb,carrier concentration and the mobility at 420℃ and 450℃ due to impurity scattering caused by the increase in carrier concentration,and increases with temperature,but at 480℃,the mobility decreases considerably due to the decrease in defect density.A 7000  Be doped GaSb buffer layer is grown on a GaSb substrate,followed by a 5000  Te doped GaSb film.The results show that due to the presence of P type buffer layer,the film appears as a P type semiconductor when the source temperature is 420℃,the presence of hole carriers increases the overall carrier concentration of the film,but the compensation of holes and electrons significantly reduces the mobility.When the source temperature is 450℃ and 480℃,the film is still N type semiconductor,and the carrier concentration which is 2~3 times that of GaSb film grown on GaAs substrate increases with temperature.The mobility is highest at 450℃ and decreases at 480℃.Setting the GaTe source temperature at 450℃ with higher carrier concentration and higher mobility of GaSb thin films involved in the preparation of superlattice materials can make the best effect of the whole material.

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金姝沛,胡雨农,刘铭,孙浩,王成刚. Te掺杂的GaSb材料载流子特性研究[J].激光与红外,2024,54(4):561~568
JIN Shu-pei, HU Yu-nong, LIU Ming, SUN Hao, WANG Cheng-gang. Study on carrier characteristics of Te doped GaSb materials[J]. LASER & INFRARED,2024,54(4):561~568

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  • 最后修改日期:2023-09-17
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  • 在线发布日期: 2024-04-16
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